Alternative Mechanical Interconnects - Electrically Conductive Adhesives

Final Report of NCMS Project No. 170501 (October 1997)

This report summarizes the evaluation of isotropically conductive adhesives (ICAs) as a replacement for eutectic solder in surface mount printed circuit applications. The phased project included a thorough survey and evaluation of adhesives, resulting in a set of minimum performance requirements for a surface mount solder replacement. By working with only certain candidate adhesives, it was possible to define process parameters, identify performance limits based on accelerated environmental testing, and cost analyses. The project resulted in the formulation of a new flexible conductive epoxy to address the deficiencies in impact strength and resistance stability encountered with commercial materials.

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