Six Sigma® Surface Mount Technology

Final Report of NCMS Project No. 160201 (September 1998)

The Six Sigma® Surface Mount Technology project objective was to significantly improve assembly process yields, with an ultimate goal of developing a methodology to achieve a six sigma quality level. The project effort, completed in May 1997, focused on the solder paste deposition, component lead quality, and component placement process aspects of SMT. Project team members used a continuous improvement methodology to establish baseline performance, conduct benchmark evaluation, refine existing process capabilities, and identify or develop low-cost process monitoring equipment or specifications.

Soft cover, 174 pages, 87 figures (more than a third in color), 24 tables.

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